Job Details

JOB SUMMARY

Responsible for performing physical failure analysis of glass substrates. This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures. The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team.

DUTIES/RESPONSIBILITIES:

· Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniques

· Prepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant features

· Use optical microscopes, electron microscopes, and other imaging tools to examine samples at various scales

· Analyze images to identify defects, fractures, corrosion, and other anomalies

· Analyze data collected from various analyses to develop comprehensive understanding of failure mechanism

· Generate detailed reports outlining findings, analysis methodologies, and recommendations

· Utilize spectroscopic methods to identify material compositions and elemental distributions

· Perform mechanical and thermal testing

· Prepare reports and documentation of failure analysis results

· Work with other engineers and scientists to develop and improve the failure analysis process

· Participate in quality control procedures, including instrument calibration and performance check

· Troubleshoot technical issues

· Provide support to the OQA function with analysis results

REQUIREMENTS:

· Experiences on SEM / FIB equipments (Analysis tools)

· Excellent analytical and problem-solving skills to identify root cause of failures

· Strong attention to detail and ability to accurately document findings and observations

· Excellent and proven personnel management skills

· Excellent communication skills and a proven ability to juggle multiple high priority tasks

QUALITIFICATIONS:

· Strong knowledge of electronic devices and their failure mechanisms

· Experience with a variety of failure analysis techniques

· Proficiency in microscopy techniques, material analysis, and spectropy

· Strong understanding of material properties, fracture mechanics, and root cause analysis

· Proficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX)

EDUCATION:

· Bachelor’s degree in material science, electrical engineering, or related field

EXPERIENCE:

· 3+ years of experience in physical failure analysis in electronic or semiconductor applications

Experiences in Manufacturing